THREAT OPS › CVEs › CVE-2023-33063
CVE-2023-33063 — Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Vulnerability details
- Affected productsMultiple Chipsets
- KEV remediation due2023-12-26